The PSA hot melt adhesive industry is currently experiencing significant advancements and growth, driven by innovation and expanding market demands. Key developments are focused on production capacity, technological breakthroughs, and strong market trends.

Firstly, in terms of production capacity, there has been a major expansion in China. Zhuhai Yongsheng, a company under Dongjiang Environmental, recently completed a project that significantly increased its production capabilities. The company's daily processing capacity for hot melt adhesive pellets has surged from just 3-5 tons to an impressive 15-18 tons. This expansion is expected to generate substantial additional annual revenue, highlighting the robust demand and strategic focus on scaling up production efficiently.

In parallel, a notable technological breakthrough is shaping the future of high-performance PSAs. Researchers have developed a novel photoanionic curing system. This innovative technology allows adhesives to cure in merely two hours under UV light, even in the presence of air—a stark contrast to traditional thermal curing methods that can take days. The resulting adhesive boasts a strong peel strength of 1.3 N/cm and can withstand extreme temperatures up to 220°C. This advancement is particularly crucial for demanding applications like temporary bonding in semiconductor manufacturing.

Supporting these developments, the market outlook remains very strong. The global market for PSAs used in electronics is projected to grow at a compound annual growth rate (CAGR) of approximately 6.2-6.4% through 2031. This growth is primarily fueled by continuous innovation and demand in the consumer electronics and automotive sectors. Furthermore, the market for hot melt application equipment, such as spray guns, is also poised for robust expansion, reflecting the increasing adoption of these adhesives in automated production environments like packaging and electronics assembly.